PACK EXPO International 2012
With an expanded focus on processing and integrated processing-packaging systems, PACK EXPO International 2012 is the one and only place to find total solutions. No other show in the industry can match its size, its scope or its impact on so many vertical markets.
As usual, Bunting® Magnetics Company will be on hand to display our full lineup of products. This includes industry-leading equipment for magnetic separation, metal detection, material handling and the printing industry.
We will be located in the North Hall at McCormick Place at booth # N-3543.
For four full days, PACK EXPO International 2012 brings together more than 46,000 buyers from all over the globe and 1,800-plus leading suppliers, showcasing state-of-the art materials, machinery and methods for packaging and processing in every market. Far and away the industry’s premier event, PACK EXPO International comprises more than 1.1 million square feet of exhibit space, featuring:
- Integrated processing-packaging solutions, dramatically improving efficiency and flexibility
- Breakthrough technology, providing a platform for next-generation product development
- On-site demonstrations, where buyers can see machinery in action to evaluate its compatibility, adaptability and ease of operation
- Revolutionary product launches, opening new possibilities for improved safety, security, sustainability and cost savings
October 28-31, 2012, 9:00 am – 5:00 pm each day
For more information on the show, visit the event web site at: